Avand o presupusa data de lansare pentru sfarsitul acestui an, terminalul iPhone 6 ar trebui sa fie primul care ar avea implementat viitorul chip A8 pe care Apple il dezvolta in momentul de fata. Pentru a fi sigura ca are indeajuns de multe componente disponibile in timp util, cei de la Apple ar fi incheiat deja contracte de productie cu 3 companii, Amkor Technology, STATS ChipPAC si Advanced Semiconductor Engineering (ASE), urmand a produce 60% din numarul total de chip-uri care vor fi incluse in iPhone 6.
Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE), according to industry sources. Taiwan Semiconductor Manufacturing Company (TSMC), which is believed to have landed foundry orders for Apple’s next-generation A8 chip, has also secured wafer bumping orders for the processor as part of its turnkey solution, the sources indicated.
Separat de acestea, compania Apple ar fi incheiat contacte si cu Samsung sau TSMC pentru fabricarea viitorului chip A8, aceste doua companii urmand a fabrica restul de 40% dintre comenzi, Samsung urmand a avea cea mai mica parte dintre ele. Chip-ul A8 al companiei Apple ar urma sa fie produs folosind un proces de fabricatie de 20nm, acest lucru permitand reducerea dimensiunilor sale, dar in acelasi timp permitand o eficientizare a consumului de energie si o imbunatatire a performantelor.
